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About XINYUANProviding high-heat-dissipation and highly reliable solutions for power semiconductor packaging and advanced integrated circuit packaging.About XINYUAN Development Timeline Qualifications & Honors Offices and Contact Information Contact Us
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Products & Applications
Pressure Sinter Silver Paste Sinter Copper Electrode Silver Film Pressure Sinter Copper Paste Chip-level Sinter Spacer Pressureless Sinter Silver Paste Pressureless Sinter Silver Adhesive
PA-100A03B Chip-level Sinter Silver PasteA silver paste capable of achieving low-temperature chip-level interconnections, with a sintering temperature as low as 230°C. Compared to traditional solders, this product offers a 5x improvement in thermal conductivity and extends service life by more than 10 times. Utilizing a printing process, it is suitable for connections between power chips and substrates, ensuring higher thermal conductivity and reliability in applications.
PA-100A02 Chip-level Sinter Silver PasteA silver paste capable of achieving low-temperature chip-level interconnections, with a sintering temperature as low as 230°C. Compared to traditional solders, this product offers a 5x improvement in thermal conductivity and extends service life by more than 10 times. Utilizing a printing process, it is suitable for connections between power chips and substrates, ensuring higher thermal conductivity and reliability in applications.
PA-400A05 System-level Sinter Silver PasteA silver paste capable of achieving low-temperature system-level interconnections, with a sintering temperature as low as 200°C. Unlike chip-level pressure-assisted silver pastes, this system-level sintering silver paste enables large-area (≥2000 mm²) module packaging, offering significantly superior thermal performance and mechanical reliability compared to traditional solders.
PA-400A02A System-level Sinter Silver PasteA silver paste capable of achieving low-temperature system-level interconnections, with a sintering temperature as low as 200°C. Unlike chip-level pressure-assisted silver pastes, this system-level sintering silver paste enables large-area (≥2000 mm²) module packaging, offering significantly superior thermal performance and mechanical reliability compared to traditional solders.
PA-300A01-50NP Sinter Copper ElectrodeAn electrode sheet capable of achieving top-side interconnections for chips, compatible with copper wire ultrasonic bonding for wire diameters of 300-400 μm. Compared to aluminum wire, copper wire offers superior mechanical properties, electrical conductivity, and reliability, enabling higher current density and longer service life. This solution is suitable for SiC module and IGBT module packaging applications.
PA-300A03-507B Sinter Copper ElectrodeAn electrode sheet capable of achieving top-side interconnections for chips, compatible with copper wire ultrasonic bonding for wire diameters of 300-400 μm. Compared to aluminum wire, copper wire offers superior mechanical properties, electrical conductivity, and reliability, enabling higher current density and longer service life. This solution is suitable for SiC module and IGBT module packaging applications.PA-300A03-507A Sinter Copper ElectrodeAn electrode sheet capable of achieving top-side interconnections for chips, compatible with copper wire ultrasonic bonding for wire diameters of 300-400 μm. Compared to aluminum wire, copper wire offers superior mechanical properties, electrical conductivity, and reliability, enabling higher current density and longer service life. This solution is suitable for SiC module and IGBT module packaging applications.
PA-600C01A System-level Sinter Copper PasteAn innovatively developed pressure-assisted sinter copper paste material, designed for reliable interconnections between chip/substrate and substrate/heat sink. It is compatible with the production processes and equipment used for sinter silver, while offering superior mechanical performance and cost advantages compared to silver paste. This makes it an ideal solution for high-power module packaging.
PA-700C01A Chip-level Sinter Copper PasteAn innovatively developed pressure-assisted sinter copper paste material, designed for reliable interconnections between chip/substrate and substrate/heat sink. It is compatible with the production processes and equipment used for sinter silver, while offering superior mechanical performance and cost advantages compared to silver paste. This makes it an ideal solution for high-power module packaging.
PA-500C03A1 Nano Copper Composite Solder （TLPS）A solder capable of achieving low-temperature, low-pressure interconnections, with a soldering temperature as low as 230°C. It is suitable for both large-area chip-level soldering and system-level module soldering, offering excellent mechanical strength and reliability.
PF-01A80 Pressureless Sinter Silver PasteHigh Thermal Conductivity Pressureless Sintered Conductive Silver Paste. Thermal conductivity up to 270 W/m·K, curing temperature 200℃.With exhibits stable and high bond strength on gold/silver interfaces.
PF-02A795A Pressureless Sinter Silver PasteMedium to High Thermal Conductivity Pressureless Sintered Conductive Silver Paste with curing temperature 200℃. Outstanding continuous workability, wide process window, excellent thermal conductivity and reliability.
PF-01B89SF6B Pressureless Semi-Sinter Silver AdhesiveMedium to High Thermal Conductivity Pressureless Semi-Sintered Conductive Adhesive. Enables interconnection of high stress mismatch structures and long-term service reliability.
PF-01B91D Pressureless Sinter Silver AdhesiveMedium to High Thermal Conductivity Pressureless Semi-Sintered Conductive Adhesive with stable high bond strength on gold/silver interfaces. Particularly suitable for high-power and large-size LED packaging.
PF-01B91C High Thermal Conductivity Conductive AdhesiveHigh Thermal Conductivity Conductive Adhesive with high thermal conductivity, long working time, 260℃ heat resistance. Suitable for medium to small power, high-reliability LED products.
PF-03B85 High Temperature Resistance Conductive AdhesiveHigh Temperature Resistance Conductive Adhesive with strong dispensing stability, long working time, 260℃ heat resistance. Suitable for small-power LED products. -
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About XINYUANProviding high-heat-dissipation and highly reliable solutions for power semiconductor packaging and advanced integrated circuit packaging.
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About XINYUANProviding high-heat-dissipation and highly reliable solutions for power semiconductor packaging and advanced integrated circuit packaging.
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